DISCO laser grooving

Low-k Grooving

https://www.disco.co.jp

Laser grooving process. First, the DFL7161 rapidly makes two laser grooves in the dicing street - either Pi Laser Grooving or Omega Laser Grooving; then the ...

Low-k膜開槽加工

https://www.disco.co.jp

利用採用該項加工製程，能夠提高生產效率，減少甚至解決因崩裂、分層（薄膜剝離）等不良因素造成的加工品質問題。 Pi (π)雷射開槽加工(階梯式切割刀片切割). Pi (π)雷射開 ...

Laser grooving kerf check function

https://www.disco.co.jp

This function can be installed as a user-specified specification. DISCO offers various kerf check methods for various applications. For details, please contact ...

DFL7161

https://www.disco.co.jp

High-quality, high-throughput standard laser grooving model · DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use. · It ...

Laser Dicing

https://www.disco.co.jp

The low-K grooving process removes the wiring layer, including the low-K film, using laser grooving equipment. Solutions · Blade Dicing · Laser Dicing.

Stealth dicing

https://www.dicing-grinding.co

View the DISCO laser saws use. ... There are various types of laser ablation depending on material being processed and also type of processing application, such ...

Low

https://www.youtube.com

Ablation process

https://www.disco.co.jp

The ablation provides three types of processes - grooving, full cut, and scribing - by adjusting the laser depth. Grooving ・Process that removes the fine ...

Disco

https://www.aurotech.com

High-quality, high-throughput standard laser grooving model. Φ300 mm. Ablation. DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already ...